云熔智算YunRong · v0.9 BETA 由新加坡国立大学闫文韬教授团队研发 Developed by Prof. Wentao Yan's team at NUS

首印即成
非凡智造
First time right
3D printing

全流程 3D 打印仿真
金属增材制造仿真平台
END-TO-END 3D PRINTING SIMULATION
METAL AM SIMULATION PLATFORM

让金属 3D 打印从试错,变成可预测工程。上传零件、材料与设备参数,云熔智算YunRong在打印前预测变形、裂纹、孔隙、组织与性能,并给出可执行的工艺优化建议。 Turn metal 3D printing from trial-and-error into predictable engineering. Upload your part, material, and machine parameters — 云熔智算YunRong predicts distortion, cracking, porosity, microstructure, and properties before you print, and delivers actionable process optimization.

选择性激光熔化 SLMSLM· 电子束熔化 EBMEBM· 粘结剂喷射BINDER JET· Ti-6Al-4V· 316L· Inconel 718· AlSi10Mg· 高熵合金HIGH-ENTROPY ALLOYS· TiB₂/Al MMC· CoCr· 选择性激光熔化 SLMSLM· 电子束熔化 EBMEBM· 粘结剂喷射BINDER JET· Ti-6Al-4V· 316L· Inconel 718
仿真精度SIM ACCURACY
92.3%
与实验吻合度
agreement with experiment
AI 推理AI INFERENCE
10ms
对比 CPU 2小时44分
vs 2h 44m on CPU
GPU 加速GPU SPEEDUP
15×
A800 vs 20核 CPU · 百万网格
A800 vs 20-core CPU · 1M cells
仿真功能SIM FUNCTIONS
40+
10+ 独有功能
10+ proprietary
增材制造仿真实景 · 自动播放 Live AM simulation footage · auto-playing

看着仿真
从一颗粉末跑到整个零件
Watch a simulation grow
from a single grain to the full part

Thermal stress evolution
Mechanical properties — strain animation Deformed mesh — final state
SIM · LIVE
01 / 04
粉末PARTICLE316L · 30 μm
熔池温度MELT TEMP~1800 K
扫描速度SCAN VEL1.2 m/s
晶粒模型GRAIN IDCA + PHASE FIELD
尺度SCALE50 μm
最大应力 σσ MAX3.2 GPa
尺度SCALE零件 · 25 mmPART · 25 mm
延度DUCTILITYε 24%
疲劳寿命FATIGUE10⁶ 次循环10⁶ CYCLES
阶段 01 / 05STAGE 01 / 05

粉末铺设

Powder spreading

颗粒尺度的离散元仿真重现真实粉末床 — 摩擦、范德华力、颗粒分级一颗不漏。这是后续所有物理的起点。

Particle-scale discrete-element simulation replicates real powder beds — friction, van der Waals, size segregation, every grain modeled. This is where every later physics step starts.

  • 铺粉均匀度预测
  • Spreading uniformity
  • 颗粒分级 / 卷起
  • Particle segregation / pickup
  • 粘结剂喷射耦合
  • Binder jetting coupling
阶段 02 / 05STAGE 02 / 05

熔池动力学

Melt-pool dynamics

激光扫过的瞬间发生了什么?热流、马兰戈尼对流、蒸发反冲压、匙孔失稳 — 多物理场耦合实时求解,温度场以颜色直接显示。

What happens the instant the laser passes? Heat flow, Marangoni convection, evaporation recoil, keyhole instability — all multi-physics fields coupled and solved in real time. Color encodes temperature.

  • Ray-tracing 真实热源
  • Ray-traced heat source
  • 蒸发 / 匙孔效应
  • Evaporation / keyholing
  • 磁场 · 超声 · 极端环境
  • Magnetic · ultrasound · extreme env.
阶段 03 / 05STAGE 03 / 05

微观结构演化

Microstructure evolution

熔池凝固时晶粒是怎么长出来的?相场建模逐层模拟形核、长大、粗化 — 不同晶粒方向用不同颜色,让"看不见的合金组织"变成可视可量化的数据。

How do grains grow as the melt pool solidifies? Phase-field modeling traces nucleation, growth and coarsening layer-by-layer — each grain orientation a distinct color, turning invisible microstructure into quantitative data.

  • 相场晶粒建模
  • Phase-field grain model
  • 枝晶 / 收缩孔识别
  • Dendrites / shrinkage pores
  • 抗热裂判据
  • Hot-crack criterion
阶段 04 / 05STAGE 04 / 05

热应力 / 残余应力

Thermal & residual stress

层层堆积后,残余应力如何分布?一个 3D 色谱清晰展示从蓝色(拉应力 −130 MPa)到红色(压应力 3.2 GPa)的真实分布 — 直接告诉你哪儿会翘曲、哪儿会裂。

After layers stack up, how is residual stress distributed? A 3D color map shows the real distribution from blue (tension −130 MPa) to red (compression 3.2 GPa) — telling you exactly where warpage and cracking will appear.

  • 晶粒位错密度
  • Dislocation density
  • 整件翘曲预测
  • Bulk warpage prediction
  • 裂纹萌生位置
  • Crack initiation sites
阶段 05 / 05STAGE 05 / 05

机械性能预测

Mechanical properties

从微观尺度的应力分布出发,外推到宏观零件的延展性、疲劳寿命与断裂行为 — 让工程师在打印之前就知道这个零件能不能用、能用多久。

From microscopic stress distributions out to bulk ductility, fatigue life and fracture behavior — engineers know if the part will work, and how long it will last, before it's ever printed.

  • 延展性预测
  • Ductility prediction
  • 疲劳寿命估算
  • Fatigue life estimation
  • 断裂力学分析
  • Fracture mechanics

仿真不是目的 Simulation isn't the goal. 首印即成才是 First-print success is.

01

提升打印成功率 Higher print success rate

打印前在虚拟环境中完整模拟过程,预测缺陷与形变。在已验证案例中,仿真显著降低了金属打印常见的 20–30% 失败率,提升首件成功的把握。

Run the full print in a virtual environment first — defects and distortion predicted before you commit material. In validated cases, simulation markedly reduced the 20–30% failure rate typical of metal AM.

首件成功率FIRST-PRINT SUCCESS 显著提升much higher
02

大幅减少试错次数 Fewer trial iterations

在仿真中完成参数迭代,找到最优工艺窗口后再实际打印。在典型工艺开发项目中,目标是把 3–7 次试印压缩到 1–2 次 — 每一次试错都是上万元的粉末与几十个小时。

Iterate in silico, find the optimal process window, then print. In a typical process-development project, the goal is to compress 3–7 trial prints down to 1–2 — every avoided trial saves tens of thousands in powder and dozens of hours.

试印次数(目标)TRIALS (TARGET) 3–7 → 1–2
03

缩短工艺开发周期 Shorter process-dev cycle

云熔智算的 AI 助手 SimuAgent 自动设置参数、自动生成报告。原本需要数周的工艺摸索,在 AI 辅助下有望压缩到数天。

The SimuAgent assistant auto-configures parameters and writes the report. Weeks of process-window hunting can shrink to days with AI assistance.

开发周期DEV CYCLE 数周 → 数天weeks → days
04

仿真预测 ↔ 实验 高度一致 Sim predictions match experiment

仿真不是 demo — 每一个预测都拿到实验台上逐项比对。钨倒铜复合材料 EBAM 案例中,仿真与实验达到 90% 一致性。

Simulation isn’t a demo — every prediction is matched against experiment, line by line. In the W/Cu EBAM case, sim and experiment agreed at 90%.

SIM ↔ EXPSIM ↔ EXP 90%

以上为典型工艺开发项目的目标区间与已验证案例的结果;实际效果因材料、设备与零件而异。 Figures above reflect targets in typical process-development projects and results from validated cases; actual outcomes vary by material, machine and part.

REASON 01 · 世界领先的增材制造仿真精度World-leading AM simulation accuracy

屡获大奖的
增材制造仿真精度
Award-winning
AM simulation accuracy

多物理场耦合仿真引擎,覆盖流场、热场、电磁场,从微观晶粒生长到宏观机械性能逐层重现 3D 打印过程。每一个仿真结果都经过实验验证。 A multi-physics coupled simulation engine spanning flow, thermal and electromagnetic fields — reproducing the entire AM process from grain-scale microstructure up to bulk mechanical properties, every result experimentally validated.

  • 仿真精度 92.3%Accuracy 92.3%
  • 2022 / 2025 NIST 增材制造挑战赛 8 个第一8× 1st place · NIST AM Bench 2022 / 2025
  • 200+ 篇同行评议论文支撑Backed by 200+ peer-reviewed publications
了解仿真引擎Explore the engine
实验 vs 仿真 · 应变云图EXP vs SIM · STRAIN OVERLAY R² = 0.978
Experiment vs simulation strain overlay
实验Experiment 云熔智算YunRong
2022 NIST AM Bench · 5× 第一 + 4× 第二2022 NIST AM Bench · 5× 1st + 4× 2nd 2022
2022 NIST AM Bench award plaques
REASON 02 · 全流程覆盖End-to-end coverage

覆盖 3D 打印
全流程
One platform
covering the full AM pipeline

40+ 仿真功能,10+ 独有。从粉末铺设到熔池演化、微观结构生长、残余应力,到最终零件机械性能 — 一个引擎,一套数据。 40+ simulation functions, 10+ proprietary. From powder bed to melt-pool dynamics, microstructure evolution and residual stress, all the way to final part properties — one engine, one data flow.

  • 支持 SLM / EBM / 粘结剂喷射等主流工艺SLM · EBM · Binder Jetting and more
  • 金属、合金、复合材料、高熵合金Metals · alloys · composites · HEAs
查看功能矩阵See feature matrix
金属 3D 打印全流程仿真 Metal AM end-to-end simulation
REASON 03 · GPU 并行加速GPU acceleration

百万网格
15 倍加速
A million cells,
15× faster

同等精度下,CPU 与 GPU 各有原生求解器;百万网格算例:RTX 3070 较 20 核 CPU 提速 2.5 倍,A800 提速 15 倍 — 让仿真不再是瓶颈。 At matched accuracy — with dedicated CPU- and GPU-native solvers — a one-million-cell case runs 2.5× faster on an RTX 3070 than a 20-core CPU, and 15× faster on an A800 — simulation stops being the bottleneck.

  • GPU 集群扩展仿真尺寸上限GPU clusters scale up domain size
  • AI 预测与高保真仿真高度吻合AI predictions match high-fidelity sim
  • 支持云端弹性算力Elastic cloud compute
查看性能基准See benchmarks
百万网格算例 · 不同硬件1M-CELL CASE · DIFFERENT HARDWARE
20 核 CPU20-core CPU
基准 1×BASELINE 1×
RTX 3070 · GPURTX 3070 · GPU
2.5 倍提升2.5× faster
A800 · GPUA800 · GPU
15 倍提升15× faster
同等精度 · 百万网格算例实测 Equal accuracy · one-million-cell benchmark
REASON 04 · SIMUAGENT AI

对话即仿真
零门槛上手
Conversation in,
simulation out

SimuAgent AI 助手把仿真所需的几十个参数压成一句话需求。自动建模、自动求解、自动出分析报告 — 工程师不必再是 CAE 专家。 SimuAgent collapses dozens of simulation parameters into a single natural-language request. It auto-builds the model, runs the solver, and writes the analysis report — your engineers no longer need to be CAE specialists.

  • 自动参数化、自动网格、自动后处理Auto-parameterize · auto-mesh · auto-postprocess
  • 输出可解释的工艺优化建议Explainable process recommendations
  • 支持企业知识库 + 工艺包嵌入Bring-your-own knowledge base
试用 SimuAgentTry SimuAgent
SIMUAGENT · DEMO ● LIVE
已与全球数十家科研机构、商业公司建立合作 —— Trusted by dozens of research institutes & companies worldwide ——
告诉我们你的打印难题Tell us your AM problem

把工艺难题
交给云熔智算。
Hand off your toughest
process problem.

提交一个简短的需求,我们的应用工程师会在 48 小时内回复你 — 评估可行性、给出仿真路径、安排 Demo。 Send a short brief. Our application engineers reply within 48 hours — feasibility check, simulation plan, Demo slot.

  • 01
    不需要任何 CAE 经验 No CAE expertise required 简单描述零件、材料、设备即可 Just describe part · material · machine
  • 02
    NDA 优先 NDA-first 所有 CAD 与工艺数据严格保密 All CAD & process data kept confidential
需求提交 · DEMAND BRIEF DEMAND BRIEF · 需求提交
✓ 已收到,48 小时内回复。 ✓ Received — we'll reply within 48h.